Welcome message

Thorsten Berger; Paulo Borba; Gul Calikli; Goetz Botterweck; Tomi Männistö; Sarah Nadi; Timo Kehrer; David Benavides; Jabier Martinez; Christoph Seidl; Jianmei Guo; Philippe Collet; Julia Rubin; Oscar Diaz; Rick Rabiser; Christoph Elsner; Rafael Capilla; Natsuko Noda; Jesper Andersson; Mohammad Reza Mousavi; Andreas Wortmann; Sandro Schulze; Yingfei Xiong; Rodrigo Bonifacio; Truong Ho-Quang; Rebekka Wohlrab; Mukelabai Mukelabai; Tomislava Andric; Jan Bosch; Dan Hao

Welcome message

Thorsten Berger, Paulo Borba, Gul Calikli, Goetz Botterweck, Tomi Männistö, Sarah Nadi, Timo Kehrer, David Benavides, Jabier Martinez, Christoph Seidl, Jianmei Guo, Philippe Collet, Julia Rubin, Oscar Diaz, Rick Rabiser, Christoph Elsner, Rafael Capilla, Natsuko Noda, Jesper Andersson, Mohammad Reza MousaviAndreas Wortmann, Sandro Schulze, Yingfei Xiong, Rodrigo Bonifacio, Truong Ho-Quang, Rebekka Wohlrab, Mukelabai Mukelabai, Tomislava Andric, Jan Bosch, Dan Hao

研究成果: Editorial

元の言語	English
ページ（範囲）	x
ジャーナル	ACM International Conference Proceeding Series
巻	1
出版物ステータス	Published - 2018 8 20
イベント	22nd International Systems and Software Product Line Conference, SPLC 2018 - Gothenburg, Sweden 継続期間: 2018 9 10 → 2018 9 14

ASJC Scopus subject areas

Software
Human-Computer Interaction
Computer Vision and Pattern Recognition
Computer Networks and Communications

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これを引用

Berger, T., Borba, P., Calikli, G., Botterweck, G., Männistö, T., Nadi, S., Kehrer, T., Benavides, D., Martinez, J., Seidl, C., Guo, J., Collet, P., Rubin, J., Diaz, O., Rabiser, R., Elsner, C., Capilla, R., Noda, N., Andersson, J., ... Hao, D. (2018). Welcome message. ACM International Conference Proceeding Series, 1, x.

Welcome message. / Berger, Thorsten; Borba, Paulo; Calikli, Gul; Botterweck, Goetz; Männistö, Tomi; Nadi, Sarah; Kehrer, Timo; Benavides, David; Martinez, Jabier; Seidl, Christoph; Guo, Jianmei; Collet, Philippe; Rubin, Julia; Diaz, Oscar; Rabiser, Rick; Elsner, Christoph; Capilla, Rafael; Noda, Natsuko; Andersson, Jesper; Mousavi, Mohammad Reza; Wortmann, Andreas; Schulze, Sandro; Xiong, Yingfei; Bonifacio, Rodrigo; Ho-Quang, Truong; Wohlrab, Rebekka; Mukelabai, Mukelabai; Andric, Tomislava; Bosch, Jan; Hao, Dan.

：: ACM International Conference Proceeding Series, 巻 1, 20.08.2018, p. x.

研究成果: Editorial

Berger, T, Borba, P, Calikli, G, Botterweck, G, Männistö, T, Nadi, S, Kehrer, T, Benavides, D, Martinez, J, Seidl, C, Guo, J, Collet, P, Rubin, J, Diaz, O, Rabiser, R, Elsner, C, Capilla, R, Noda, N, Andersson, J, Mousavi, MR, Wortmann, A, Schulze, S, Xiong, Y, Bonifacio, R, Ho-Quang, T, Wohlrab, R, Mukelabai, M, Andric, T, Bosch, J & Hao, D 2018, 'Welcome message', ACM International Conference Proceeding Series, 巻. 1, pp. x.

Berger, Thorsten ; Borba, Paulo ; Calikli, Gul ; Botterweck, Goetz ; Männistö, Tomi ; Nadi, Sarah ; Kehrer, Timo ; Benavides, David ; Martinez, Jabier ; Seidl, Christoph ; Guo, Jianmei ; Collet, Philippe ; Rubin, Julia ; Diaz, Oscar ; Rabiser, Rick ; Elsner, Christoph ; Capilla, Rafael ; Noda, Natsuko ; Andersson, Jesper ; Mousavi, Mohammad Reza ; Wortmann, Andreas ; Schulze, Sandro ; Xiong, Yingfei ; Bonifacio, Rodrigo ; Ho-Quang, Truong ; Wohlrab, Rebekka ; Mukelabai, Mukelabai ; Andric, Tomislava ; Bosch, Jan ; Hao, Dan. / Welcome message. ：: ACM International Conference Proceeding Series. 2018 ; 巻 1. pp. x.

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AU - Berger, Thorsten

AU - Borba, Paulo

AU - Calikli, Gul

AU - Botterweck, Goetz

AU - Männistö, Tomi

AU - Nadi, Sarah

AU - Kehrer, Timo

AU - Benavides, David

AU - Martinez, Jabier

AU - Seidl, Christoph

AU - Guo, Jianmei

AU - Collet, Philippe

AU - Rubin, Julia

AU - Diaz, Oscar

AU - Rabiser, Rick

AU - Elsner, Christoph

AU - Capilla, Rafael

AU - Noda, Natsuko

AU - Andersson, Jesper

AU - Mousavi, Mohammad Reza

AU - Wortmann, Andreas

AU - Schulze, Sandro

AU - Xiong, Yingfei

AU - Bonifacio, Rodrigo

AU - Ho-Quang, Truong

AU - Wohlrab, Rebekka

AU - Mukelabai, Mukelabai

AU - Andric, Tomislava

AU - Bosch, Jan

AU - Hao, Dan

PY - 2018/8/20

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JO - ACM International Conference Proceeding Series

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T2 - 22nd International Systems and Software Product Line Conference, SPLC 2018

Y2 - 10 September 2018 through 14 September 2018

ER -