Wideband and High-Isolation Properties by the Combination of Thin-Film Embedded Capacitor and Planer EBG Structure

Toshio Sudo, Seiju Ichijo, Takanobu Kushihira

研究成果: Article

元の言語English
ページ(範囲)1212-1217
ジャーナルIEEE 57th Electronic Components and Technology Conference
出版物ステータスPublished - 2007 5 31

これを引用

@article{b3fd02521e6547a28c21136ee1fc3140,
title = "Wideband and High-Isolation Properties by the Combination of Thin-Film Embedded Capacitor and Planer EBG Structure",
author = "Toshio Sudo and Seiju Ichijo and Takanobu Kushihira",
year = "2007",
month = "5",
day = "31",
language = "English",
pages = "1212--1217",
journal = "IEEE 57th Electronic Components and Technology Conference",

}

TY - JOUR

T1 - Wideband and High-Isolation Properties by the Combination of Thin-Film Embedded Capacitor and Planer EBG Structure

AU - Sudo, Toshio

AU - Ichijo, Seiju

AU - Kushihira, Takanobu

PY - 2007/5/31

Y1 - 2007/5/31

M3 - Article

SP - 1212

EP - 1217

JO - IEEE 57th Electronic Components and Technology Conference

JF - IEEE 57th Electronic Components and Technology Conference

ER -