Wideband and high-isolation properties of power bus structure by the combination of thin-film embedded capacitor and planar EBG structure

Toshio Sudo, Seiju Ichijo, Takanobu Kushihira

研究成果: Conference contribution

5 被引用数 (Scopus)

抄録

Power bus structure in a printed circuit board (PCB) is an influential design parameter in mitigating power/ground fluctuation and radiated emission for high-speed digital circuits. The power bus is ordinarily composed of two solid planes separated by dielectric insulator in a multilayer PCB. Recently, it has been reported that an electromagnetic bandgap (EBG)-type VDD plane is effective for suppressing radiated emission for mixed-signal applications or high-speed digital applications. However, the EBG-type VDD plane often induces large power/ground bounce due to the return current discontinuity. On the other hand, the solid-type VDD and ground plane with a thinner dielectric insulator makes wide band property of the power supply impedance by eliminating the power/ground resonances. However, even adopting an insulator thickness of 16 um, the S21 property was still around -50 dB or so. In the present work, the power bus structure with wideband and high isolation properties of around -80 dB or more has been explored by the combination of thin-film insulator and planar EBG structure.

本文言語English
ホスト出版物のタイトルProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
ページ1212-1217
ページ数6
DOI
出版ステータスPublished - 2007 10 22
イベント57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
継続期間: 2007 5 292007 6 1

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Conference

Conference57th Electronic Components and Technology Conference 2007, ECTC '07
国/地域United States
CitySparks, NV
Period07/5/2907/6/1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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