Wideband ultralow power distribution network impedance evaluation of decoupling capacitor embedded interposers for 3-D integrated LSI system

Katsuya Kikuchi, Toshio Gomyo, Toshikazu Ookubo, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D and 3-D finite element method (FEM) electromagnetic field simulator. We fabricated various types of capacitor mounted or capacitor embedded interposers test element group (TEG), such as surface-mounted and embedded chip capacitors, and thin film capacitors on silicon interposers using the same simple design to compare measurement results with calculation ones. As a result, the ultralow impedance evaluation system that has a high measurement dynamic range at the entire measurable frequency band can be realized. Furthermore, by using 2.5-D and 3-D FEM electromagnetic field simulator, it is expected that the accurate and wideband comparative verification of the PDN impedance analysis and evaluation can be realized.

本文言語English
ホスト出版物のタイトル2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
ページ1190-1196
ページ数7
DOI
出版ステータスPublished - 2013 9 9
イベント2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
継続期間: 2013 5 282013 5 31

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Conference

Conference2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
国/地域United States
CityLas Vegas, NV
Period13/5/2813/5/31

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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